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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 BUK763R8-80E

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934066492118BUK763R8-80E,118BUK763R8-80ESOT404 (D2PAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 7725 ppm of the article. SCIP No. f418fbbb-02c3-4537-b339-5fe68689b4f8.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 7725 ppm; substance 7440-02-0: 3940 ppm; substance 1309-64-4: 7054 ppm; substance 1333-86-4: 783 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 7725 ppm; substance 7440-02-0: 3940 ppm; substance 1309-64-4: 7054 ppm; substance 40039-93-8: 5878 ppm; substance 1333-86-4: 783 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 124 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Solder WireLead alloyLead (Pb)7439-92-111.24664893.5000000.772589
Solder WireLead alloyTin (Sn)7440-31-50.6014255.0000000.041315
Solder WireLead alloySilver (Ag)7440-22-40.1804271.5000000.012394
Solder Wire Total12.028500100.0000000.826298
DieDoped siliconSilicon (Si)7440-21-39.800000100.0000000.673211
Die Total9.800000100.0000000.673211
Lead FrameCopper alloyCopper (Cu)7440-50-8822.50997998.97000056.502325
Lead FrameCopper alloyNickel (Ni)7440-02-05.7343830.6900000.393923
Lead FrameCopper alloyPhosphorus (P)7723-14-01.9945680.2400000.137017
Lead FrameCopper alloyIron (Fe)7439-89-60.8310700.1000000.057090
Lead Frame Total831.070000100.00000057.090355
Mould CompoundFillerSilica fused60676-86-0427.89000075.00000029.393905
Mould CompoundPolymerEpoxy resin system81.77451414.3333305.617500
Mould CompoundPolymerPhenolic resin40.8872867.1666702.808752
Mould CompoundFlame retardantAntimony trioxide (Sb2O3)1309-64-410.2693601.8000000.705454
Mould CompoundFlame retardantEpichlorohydrin-tetrabromobisphenol A copolymer40039-93-88.5578001.5000000.587878
Mould CompoundPigmentCarbon black1333-86-41.1410400.2000000.078384
Mould Compound Total570.520000100.00000039.191873
Post-PlatingTin alloyTin (Sn)7440-31-519.78802199.9900001.359338
Post-PlatingImpurityNon-declarable0.0019790.0100000.000136
Post-Plating Total19.790000100.0000001.359474
Wire 1Pure metalAluminium (Al)7429-90-512.24512599.9900000.841179
Wire 1Pure metalNickel (Ni)7440-02-00.0012250.0100000.000084
Wire Total12.246350100.0000000.841263
Wire 1 Total12.246350100.0000000.841263
Wire 2Pure metalAluminium (Al)7429-90-50.25510699.9900000.017524
Wire 2ImpurityNon-declarable0.0000260.0100000.000002
Wire Total0.255132100.0000000.017526
Wire 2 Total0.255132100.0000000.017526
BUK763R8-80E Total1455.709982100.000000100.000000
Notes
Report created on 2024-12-21 22:16:58 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
245 °C40 s220 °C30 s3
Notes
Report created on 2024-12-21 22:16:58 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
焊錫絲 (Solder Wire)??????
半導(dǎo)體芯片 (Die)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
導(dǎo)線 (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:16:58 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.