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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)
WLCSP15_6-3-6

WLCSP15_6-3-6

wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body

外形圖

封裝版本 封裝名稱 封裝說明 參考 發行日期
WLCSP15_6-3-6 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body 2010-02-11

相關文檔

文件名稱 標題 類型 日期
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 PCMF3USB3X, PCMF3HDMI2X and PESD3USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing information 2020-04-27

采用此封裝的產品

ESD protection, TVS, filtering and signal conditioning

        


        
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PESD3USB30

ESD protection for differential data lines