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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 74HCT165BQ

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93528607411574HCT165BQ,11574HCT165BQSOT763-1 (DHVQFN16)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 8900 ppm; substance 1333-86-4: 952 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 8900 ppm; substance 1333-86-4: 952 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 3491 ppm; substance 7440-05-3: 870 ppm; substance 7440-57-5: 108 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.07476075.0000000.349075
AdhesivePolymerResin system0.01794218.0000000.083778
AdhesivePolymerAcrylic resin0.0059816.0000000.027926
AdhesiveAdditiveNon-declarable0.0009971.0000000.004654
Adhesive Total0.099680100.0000000.465433
DieDoped siliconSilicon (Si)7440-21-30.356490100.0000001.664550
Die Total0.356490100.0000001.664550
Lead FrameCopper alloyCopper (Cu)7440-50-88.04357595.05704537.557656
Lead FrameCopper alloyIron (Fe)7439-89-60.1980572.3405900.924780
Lead FrameCopper alloyZinc (Zn)7440-66-60.0082520.0975200.038533
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0024760.0292610.011560
Base Alloy Total8.25236097.52441638.532529
Lead FramePure metal layerPalladium (Pd)7440-05-30.0167580.1980420.078250
Pre-Plating 1 Total0.0167580.1980420.078250
Lead FramePure metal layerNickel (Ni)7440-02-00.1906272.2527840.890089
Pre-Plating 2 Total0.1906272.2527840.890089
Lead FramePure metal layerGold (Au)7440-57-50.0020950.0247580.009781
Pre-Plating 3 Total0.0020950.0247580.009781
Lead Frame Total8.461840100.00000039.510649
Mould CompoundFillerSilica fused60676-86-010.55030284.82000049.262250
Mould CompoundPolymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.149488
Mould CompoundFillerSilica7631-86-90.4341023.4900002.026942
Mould CompoundAdditiveNon-declarable0.3711642.9840001.733065
Mould CompoundPolymerPhenolic resin0.2802392.2530001.308510
Mould CompoundPolymerEpoxy resin system0.1972741.5860000.921126
Mould CompoundFlame retardantFlame retardant, organic phosphorus compound0.1246331.0020000.581947
Mould CompoundPigmentCarbon black1333-86-40.0203990.1640000.095249
Mould Compound Total12.438460100.00000058.078577
WirePure metalCopper (Cu)7440-50-80.05806196.5500000.271103
WirePure metal layerGold (Au)7440-57-50.0002110.3500000.000984
Wire Coating 1 Total0.0002110.3500000.000984
WirePure metal layerPalladium (Pd)7440-05-30.0018643.1000000.008704
Wire Coating 2 Total0.0018643.1000000.008704
Wire Total0.060136100.0000000.280791
74HCT165BQ Total21.416606100.000000100.000000
Notes
Report created on 2024-12-21 22:13:00 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:13:00 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導體芯片 (Die)??????
基底合金 (Base Alloy)??????
預鍍層1 (Pre-Plating 1)??????
預鍍層2 (Pre-Plating 2)??????
預鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
導線 (Wire)??????
導線涂層1 (Wire Coating 1)??????
導線涂層2 (Wire Coating 2)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:13:00 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.