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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 BZX79-B15

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
933166910133BZX79-B15,133BZX79-B15SOD27 (ALF2)RFS1
933166910143BZX79-B15,143BZX79-B15SOD27 (ALF2)RFS1
933166910113BZX79-B15,113BZX79-B15SOD27 (ALF2)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 1303-86-2 at 34279 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 25574 ppm; substance 7439-92-1: <1 ppm; substance 7440-48-4: 387 ppm; substance 1333-86-4: 21 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 25574 ppm; substance 7439-92-1: <1 ppm; substance 1303-86-2: 34279 ppm; substance 7440-48-4: 387 ppm; substance 1333-86-4: 21 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 148 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-30.03349566.9900000.030537
DieActive agentAntimony (Sb)7440-36-00.0000400.0800000.000037
DiePure metal layerTitanium (Ti)7440-32-60.0000650.1300000.000059
Die Metallization 1 Total0.0000650.1300000.000059
DiePure metal layerSilver (Ag)7440-22-40.01619032.3800000.014760
Die Metallization 2 Total0.01619032.3800000.014760
DiePure metal layerNickel (Ni)7440-02-00.0002100.4200000.000191
Die Metallization 3 Total0.0002100.4200000.000191
Die Total0.050000100.0000000.045584
Post-PlatingPure metal layerTin (Sn)7440-31-52.62560699.9850002.393726
Post-PlatingImpurityAntimony (Sb)7440-36-00.0001580.0060000.000144
Post-PlatingImpurityBismuth (Bi)7440-69-90.0001310.0050000.000119
Post-PlatingImpurityLead (Pb)7439-92-10.0001050.0040000.000096
Post-Plating Total2.626000100.0000002.394085
Glass TubeOxide CeramicsSilica7631-86-911.51500049.00000010.498053
Glass TubeOxide CeramicsBoron oxide (B2O3)1303-86-23.76000016.0000003.427936
Glass TubeOxide CeramicsPotassium oxide (K2O)12136-45-71.8800008.0000001.713968
Glass TubeOxide CeramicsSodium monoxide12401-86-41.4100006.0000001.285476
Glass TubeOxide CeramicsZinc oxide (ZnO)1314-13-21.4100006.0000001.285476
Glass TubeOxide CeramicsTitanium oxide (TiO)12137-20-11.1750005.0000001.071230
Glass TubeOxide CeramicsLithium oxide (Li2O)12057-24-80.9400004.0000000.856984
Glass TubeOxide CeramicsAluminium trioxide (Al2O3)1344-28-10.9400004.0000000.856984
Glass TubeOxide CeramicsNon-declarable0.4700002.0000000.428492
Glass Tube Total23.500000100.00000021.424599
DumetIron-nickel alloyIron (Fe)7439-89-63.46885040.8100003.162498
DumetIron-nickel alloyNickel (Ni)7440-02-02.80500033.0000002.557277
DumetIron-nickel alloyCopper (Cu)7440-50-81.95500023.0000001.782344
DumetIron-nickel alloyManganese (Mn)7439-96-50.1020001.2000000.092992
DumetIron-nickel alloyCopper oxide (Cu2O)1317-39-10.0850001.0000000.077493
DumetIron-nickel alloyCobalt (Co)7440-48-40.0425000.5000000.038747
DumetIron-nickel alloySilicon (Si)7440-21-30.0255000.3000000.023248
DumetIron-nickel alloyCarbon (C)7440-44-00.0127500.1500000.011624
DumetIron-nickel alloyPhosphorus (P)7723-14-00.0017000.0200000.001550
DumetIron-nickel alloySulfur (S)7704-34-90.0017000.0200000.001550
Dumet Total8.500000100.0000007.749323
LeadsPure metalIron (Fe)7439-89-663.75000085.00000058.119923
LeadsPure metalCopper (Cu)7440-50-811.25000015.00000010.256457
Leads Total75.000000100.00000068.376380
Marking InkInkNon-declarable0.00768969.9000000.007010
Marking InkInkCarbon black1333-86-40.00235021.3600000.002143
Marking InkInkPhenol108-95-20.0009618.7400000.000876
Marking Ink Total0.011000100.0000000.010029
BZX79-B15 Total109.687000100.000000100.000000
Notes
Report created on 2024-12-21 22:19:19 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)??????
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)??????
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)??????
半導(dǎo)體芯片金屬化層3 (Die Metallization 3)??????
后鍍層 (Post-Plating)??????
玻璃管 (Glass Tube)??????
杜美絲 (Dumet)??????
引腳 (Leads)??????
標(biāo)記墨水 (Marking Ink)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:19:19 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.