化學成分 GANB8R0-040CBA

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934667631341	GANB8R0-040CBAZ	GANB8R0-040CBA	WLCSP16_SOT8087 (WLCSP16)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Does not contain California Proposition 65 substances.
IEC 62474	Does not contain IEC 62474 substances.
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 10839 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Passivation	Polymer	Polyimide resin		0.104640	100.000000	2.004214
		Passivation Total		0.104640	100.000000	2.004214

Redistribution Layer	Pure metal layer	Copper (Cu)	7440-50-8	0.177160	100.000000	3.393219
		Redistribution Layer Total		0.177160	100.000000	3.393219

Solder Balls	Tin solder	Tin (Sn)	7440-31-5	1.351040	95.500000	25.877060
Solder Balls	Tin solder	Silver (Ag)	7440-22-4	0.056590	4.000010	1.083831
Solder Balls	Tin solder	Copper (Cu)	7440-50-8	0.007070	0.499990	0.135451
		Solder Balls Total		1.414700	100.000000	27.096342

Under Bump Metallization 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.001440	100.000000	0.027581
		Under Bump Metallization 1 Total		0.001440	100.000000	0.027581

Under Bump Metallization 2	Pure metal layer	Copper (Cu)	7440-50-8	0.014260	100.000000	0.273128
		Under Bump Metallization 2 Total		0.014260	100.000000	0.273128

Under Bump Metallization 3	Pure metal layer	Copper (Cu)	7440-50-8	0.094980	100.000000	1.819192
		Under Bump Metallization 3 Total		0.094980	100.000000	1.819192

Die	Doped silicon	Silicon (Si)	7440-21-3	3.361210	98.459080	64.378718
Die	Metallisation	Gallium Nitride (GaN)	25617-97-4	0.030320	0.888080	0.580708
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.022290	0.652840	0.426898
		Die Metallization Total		0.022290	0.652840	0.426898
		Die Total		3.413820	100.000000	65.386324

		GANB8R0-040CBA Total		5.221000	100.000000	100.000000

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
鈍化層 (Passivation)	?	?	?	?	?	?
重布層 (Redistribution Layer)	?	?	?	?	?	?
焊錫球 (Solder Balls)	?	?	?	?	?	?
底部金屬層1 (Under Bump Metallization 1)	?	?	?	?	?	?
底部金屬層2 (Under Bump Metallization 2)	?	?	?	?	?	?
底部金屬層3 (Under Bump Metallization 3)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片金屬化層 (Die Metallization)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產品

雙極性晶體管

二極管

ESD保護、TVS、信號調節

MOSFET

SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

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所有應用

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Sub-systems: Power conversion topologies

子系統

參考設計

評估板

Interactive application notes

Advanced Support Tools

化學成分 GANB8R0-040CBA

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 GANB8R0-040CBA