化學成分 PHP45NQ10T

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934055804127	PHP45NQ10T,127	PHP45NQ10T	SOT78 (SIL3P)	DOD	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 3346 ppm of the article. SCIP No. 82335932-ef67-43ae-bc5d-5f47a3b97aa5.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 3346 ppm; substance 7440-02-0: 7215 ppm; substance 1333-86-4: 1134 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 3346 ppm; substance 7440-02-0: 7215 ppm; substance 1333-86-4: 1134 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 54 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	6.573050	93.500000	0.334624
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.351500	5.000000	0.017894
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.105450	1.500000	0.005368
		Solder Wire Total		7.030000	100.000000	0.357886

Die	Doped silicon	Silicon (Si)	7440-21-3	7.400000	100.000000	0.376723
		Die Total		7.400000	100.000000	0.376723

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	1318.301720	98.600000	67.112734
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	14.172412	1.060000	0.721496
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	3.208848	0.240000	0.163358
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	1.337020	0.100000	0.068065
		Lead Frame Total		1337.020000	100.000000	68.065653

Mould Compound	Filler	Misc. silica compounds (generic)		398.761880	71.600000	20.300360
Mould Compound	Flame retardant	Metal hydroxide		55.693000	10.000000	2.835246
Mould Compound	Polymer	Epoxy resin system		55.693000	10.000000	2.835246
Mould Compound	Polymer	Phenolic resin		44.554400	8.000000	2.268197
Mould Compound	Pigment	Carbon black	1333-86-4	2.227720	0.400000	0.113410
		Mould Compound Total		556.930000	100.000000	28.352459

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	47.505249	99.990000	2.418420
Post-Plating	Impurity	Non-declarable		0.004751	0.010000	0.000242
		Post-Plating Total		47.510000	100.000000	2.418662

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	8.163417	99.990000	0.415587
Wire 1	Pure metal	Nickel (Ni)	7440-02-0	0.000816	0.010000	0.000042
		Wire Total		8.164233	100.000000	0.415629
		Wire 1 Total		8.164233	100.000000	0.415629

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	0.255106	99.990000	0.012987
Wire 2	Impurity	Non-declarable		0.000026	0.010000	0.000001
		Wire Total		0.255132	100.000000	0.012988
		Wire 2 Total		0.255132	100.000000	0.012988

		PHP45NQ10T Total		1964.309365	100.000000	100.000000

Notes
Report created on 2024-12-21 22:24:11 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
焊錫絲 (Solder Wire)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:24:11 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 PHP45NQ10T

雙極性晶體管

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化學成分 PHP45NQ10T