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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PHP79NQ08LT

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標準。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934059363127PHP79NQ08LT,127PHP79NQ08LTSOT78 (SIL3P)DODNone
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 2080 ppm of the article. SCIP No. 82335932-ef67-43ae-bc5d-5f47a3b97aa5.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 2080 ppm; substance 7440-02-0: 7249 ppm; substance 1333-86-4: 1139 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 2080 ppm; substance 7440-02-0: 7249 ppm; substance 1333-86-4: 1139 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 33 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Solder WireLead alloyLead (Pb)7439-92-14.06725093.5000000.208037
Solder WireLead alloyTin (Sn)7440-31-50.2175005.0000000.011125
Solder WireLead alloySilver (Ag)7440-22-40.0652501.5000000.003337
Solder Wire Total4.350000100.0000000.222499
DieDoped siliconSilicon (Si)7440-21-35.000000100.0000000.255746
Die Total5.000000100.0000000.255746
Lead FrameCopper alloyCopper (Cu)7440-50-81318.30172098.60000067.430050
Lead FrameCopper alloyNickel (Ni)7440-02-014.1724121.0600000.724907
Lead FrameCopper alloyPhosphorus (P)7723-14-03.2088480.2400000.164130
Lead FrameCopper alloyIron (Fe)7439-89-61.3370200.1000000.068388
Lead Frame Total1337.020000100.00000068.387475
Mould CompoundFillerMisc. silica compounds (generic)398.76188071.60000020.396343
Mould CompoundFlame retardantMetal hydroxide55.69300010.0000002.848651
Mould CompoundPolymerEpoxy resin system55.69300010.0000002.848651
Mould CompoundPolymerPhenolic resin44.5544008.0000002.278921
Mould CompoundPigmentCarbon black1333-86-42.2277200.4000000.113946
Mould Compound Total556.930000100.00000028.486512
Post-PlatingTin alloyTin (Sn)7440-31-547.50524999.9900002.429854
Post-PlatingImpurityNon-declarable0.0047510.0100000.000243
Post-Plating Total47.510000100.0000002.430097
Wire 1Pure metalAluminium (Al)7429-90-54.00007399.9900000.204601
Wire 1ImpurityNon-declarable0.0004000.0100000.000020
Wire Total4.000473100.0000000.204621
Wire 1 Total4.000473100.0000000.204621
Wire 2Pure metalAluminium (Al)7429-90-50.25510699.9900000.013049
Wire 2ImpurityNon-declarable0.0000260.0100000.000001
Wire Total0.255132100.0000000.013050
Wire 2 Total0.255132100.0000000.013050
PHP79NQ08LT Total1955.065605100.000000100.000000
Notes
Report created on 2024-12-21 22:24:11 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
焊錫絲 (Solder Wire)??????
半導(dǎo)體芯片 (Die)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
導(dǎo)線 (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:24:11 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.