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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 PMEG050T150EPD

作為一家積極進取的可持續發展公司,安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關資料,以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據,這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934069826139PMEG050T150EPDAZPMEG050T150EPDSOT1289 (CFP15)RFS1
934069826146PMEG050T150EPDZPMEG050T150EPDSOT1289 (CFP15)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 115722 ppm of the article. SCIP No. c65db56d-df5b-4e4e-9697-c24b71b5b8af.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 831 ppm; substance 7439-92-1: 115722 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 831 ppm; substance 7439-92-1: 115722 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 10708 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-32.910000100.0000003.904992
Die Total2.910000100.0000003.904992
ClipCopper alloyCopper (Cu)7440-50-87.34822499.8400009.860740
ClipCopper alloyIron (Fe)7439-89-60.0088320.1200000.011852
ClipCopper alloyPhosphorus (P)7723-14-00.0022080.0300000.002963
ClipMetallisationCopper (Cu)7440-50-80.0007360.0100000.000988
Clip Total7.360000100.0000009.876543
Lead FrameCopper alloyCopper (Cu)7440-50-833.85298798.21000045.428056
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0137880.0400000.018502
Lead FrameCopper alloyIron (Fe)7439-89-60.0034470.0100000.004626
Base Alloy Total33.87022298.26000045.451184
Lead FramePure metal layerSilver (Ag)7440-22-40.5722021.6600000.767850
Pre-Plating 1 Total0.5722021.6600000.767850
Lead FramePure metal layerCopper (Cu)7440-50-80.0275760.0800000.037005
Pre-Plating 2 Total0.0275760.0800000.037005
Lead Frame Total34.470000100.00000046.256039
Mould CompoundFillerSilica fused60676-86-014.66860071.00000019.684112
Mould CompoundPolymero-Cresol-epichlorohydrin-formaldehyde copolymer29690-82-24.07002019.7000005.461648
Mould CompoundPolymerPhenolic resin1.8594009.0000002.495169
Mould CompoundPigmentCarbon black1333-86-40.0619800.3000000.083172
Mould Compound Total20.660000100.00000027.724101
Post-PlatingTin solderTin (Sn)7440-31-50.08999199.9900000.120761
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0050000.000006
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000030.0030000.000004
Post-PlatingImpurityCopper (Cu)7440-50-80.0000010.0010000.000001
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000010.0010000.000001
Post-Plating Total0.090000100.0000000.120773
Solder PasteLead alloyLead (Pb)7439-92-18.62365095.50000011.572262
Solder PasteLead alloySilver (Ag)7440-22-40.2257502.5000000.302939
Solder PasteLead alloyTin (Sn)7440-31-50.1806002.0000000.242351
Solder Paste Total9.030000100.00000012.117552
PMEG050T150EPD Total74.520000100.000000100.000000
Notes
Report created on 2024-12-21 22:24:34 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:24:34 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯苯 (PBB) 多溴二苯醚 (PBDE)
半導體芯片 (Die)??????
夾子 (Clip)??????
基底合金 (Base Alloy)??????
預鍍層1 (Pre-Plating 1)??????
預鍍層2 (Pre-Plating 2)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
錫膏 (Solder Paste)??????
? 表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產品具有無限期的環保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:24:34 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.