參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC374D | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 185 | low | -40~125 | 84 | 27 | 61 | SO20 |
| 74AHC374PW | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 185 | low | -40~125 | 100 | 4.5 | 44.5 | TSSOP20 |
| 74AHCT374D | 4.5?-?5.5 | TTL | ± 8 | 4.3 | 140 | low | -40~125 | 84 | 27 | 61 | SO20 |
| 74AHCT374PW | 4.5?-?5.5 | TTL | ± 8 | 4.3 | 140 | low | -40~125 | 100 | 4.5 | 44.5 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC374D | 74AHC374D,118 (935262680118) |
Active | 74AHC374D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC374PW | 74AHC374PW,118 (935262681118) |
Active | AHC374 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT374D | 74AHCT374D,118 (935262682118) |
Active | 74AHCT374D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT374PW | 74AHCT374PW,118 (935262683118) |
Active | AHCT374 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC374D | 74AHC374D,118 | 74AHC374D |
|
|
| 74AHC374PW | 74AHC374PW,118 | 74AHC374PW |
|
|
| 74AHCT374D | 74AHCT374D,118 | 74AHCT374D |
|
|
| 74AHCT374PW | 74AHCT374PW,118 | 74AHCT374PW |
|
|
文檔 (12)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT374 | Octal D-type flip-flop; positive edge-trigger; 3-state | Data sheet | 2023-09-04 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc374 | ahc374 IBIS model | IBIS model | 2013-04-08 |
| ahct374 | ahct374 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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