封裝
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
BCW31 | BCW31,215 (933082781215) |
Active | D1% |
![]() (SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
BCW32 | BCW32,215 (933082791215) |
Active | D2% |
![]() (SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
BCW32,235 (933082791235) |
Active | D2% | SOT23_235 | ||||
BCW33 | BCW33,215 (933099650215) |
Active | D3% |
![]() (SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
文檔 (9)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
BCW31_BCW32_BCW33 | NPN general purpose transistors | Data sheet | 2004-02-05 |
AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT23_mk | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT23 | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Package information | 2022-10-12 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |