外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1289 | CFP15 | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body | 2014-04-29 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| SOT1289 | 3D model for products with SOT1289 package | Design support | 2019-01-22 |
| Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封裝的肖特基整流器 | Leaflet | 2022-07-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP15_SOT1289_mk | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body | Marcom graphics | 2017-01-28 |
| SOT1289 | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body | Package information | 2022-05-28 |
| SOT1289_139 | CFP15; Reel pack for SMD, 13"; Q4/T2 product orientation | Packing information | 2023-11-06 |
| SOT1289_146 | CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation | Packing information | 2023-11-06 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| PMEG045T150EIPD | 45 V, 15 A low VF Trench MEGA Schottky barrier rectifier |
|