外形圖
封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
SOT974-2 | DFN3314-16 | plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | 2010-03-25 |
相關(guān)文檔
文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
---|---|---|---|
SOT974-2 | 3D model for products with SOT974-2 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT974-2 | plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | Package information | 2022-06-15 |
SOT974-2_132 | DFN3314-16; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-12-16 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
型號(hào) | 描述 | 快速訪問(wèn) |
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