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Click here for more information74HC137DB
3-to-8 line decoder, demultiplexer with address latches; inverting
The 74HC137 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features a latch enable (LE) and two output enable (E1, E2) inputs. A LOW on LE causes the device to act as an active LOW decoder. A LOW-to HIGH transition on LE stores the data that was present before the transition in the latches. Further address changes are ignored as long as LE remains HIGH.
The output enable inputs control the state of the outputs independently of the address inputs or latch operation. All outputs will be HIGH unless E1 is LOW and E2 is HIGH.
Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Alternatives
Features and benefits
Combines 3-to-8 decoder with 3-bit latch
Multiple input enable for easy expansion or independent controls
Active LOW mutually exclusive outputs
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +80 °C and from -40 °C to +125 °C.
參數類型
型號 | Package name |
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74HC137DB | SSOP16 |
PCB Symbol, Footprint and 3D Model
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封裝
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
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74HC137DB | 74HC137DB,112 (935189660112) |
Withdrawn / End-of-life | HC137 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
74HC137DB,118 (935189660118) |
Obsolete | HC137 | 暫無信息 |
文檔 (8)
文件名稱 | 標題 | 類型 | 日期 |
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74HC137 | 3-to-8 line decoder, demultiplexer with address latches; inverting | Data sheet | 2024-01-11 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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模型
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