可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
---|---|---|---|---|
74HCT74D-Q100 | 74HCT74D-Q100,118 | 935298884118 | SOT108-1 | 訂單產(chǎn)品 |
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Click here for more informationDual D-type flip-flop with set and reset; positive edge-trigger
The 74HC74-Q100; 74HCT74-Q100 are dual positive edge triggered D-type flip-flop with individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, will be stored in the flip-flop and appear at the nQ output. The Schmitt-trigger action in the clock input, makes the circuit highly tolerant to slower clock rise and fall times. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Input levels:
For 74HC74-Q100: CMOS level
For 74HCT74-Q100: TTL level
Symmetrical output impedance
Low power dissipation
High noise immunity
Balanced propagation delays
Specified in compliance with JEDEC standard no. 7A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
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74HCT74D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | SO14 |
Model Name | 描述 |
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型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74HCT74D-Q100 | 74HCT74D-Q100,118 (935298884118) |
Active | 74HCT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74HCT74D-Q100 | 74HCT74D-Q100,118 | 74HCT74D-Q100 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74HC_HCT74_Q100 | Dual D-type flip-flop with set and reset; positive edge-trigger | Data sheet | 2024-04-02 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT108-1_118 | SO14; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-02-19 |
74HCT74D-Q100_Nexperia_Product_Reliability | 74HCT74D-Q100 Nexperia Product Reliability | Quality document | 2024-06-16 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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Model Name | 描述 |
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型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
74HCT74D-Q100 | 74HCT74D-Q100,118 | 935298884118 | Active | SOT108-1_118 | 2,500 | 訂單產(chǎn)品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.