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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

AXP1T34GM

Dual supply translating buffer

The AXP1T34 is a single bit, dual supply translating buffer. It features one input (A), an output (Y) and dual supply pins (VCCI and VCCO). Both VCCI and VCCO can be supplied at any voltage between 0.9 V and 5.5 V making the device suitable for translating between any voltage nodes specified (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). No power supply sequencing is required and output glitches during power supply transitions are prevented using patented circuitry. As a result, glitches will not appear on the outputs for supply transitions during power-up/down between 20 mV?/?μs and 5.5 V/s

The input is referenced to VCCI and the output is referenced to VCCO. Schmitt-trigger action at the input makes the circuit tolerant of slower input rise and fall times.

This device ensures low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. In suspend mode when either VCCI or VCCO are at GND level the output is in the high-impedance OFF-state

Features and benefits

  • Wide supply voltage range:

    • VCCI: 0.9 V to 5.5 V

    • VCCO: 0.9 V to 5.5 V

  • Low input capacitance; CI = 1.5 pF (typical)

  • Low output capacitance; CO = 3.8 pF (typical)

  • Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)

  • Low dynamic power consumption; CPD = 11 pF at VCCO = 5 V (typical)

  • Low static power consumption; ICCI = 0.1 μA (25 °C maximum)

  • Low static power consumption; ICCO = 1.0 μA (25 °C maximum)

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-12 (1.1 V to 1.3 V; A input)

    • JESD8-11 (1.4 V to 1.6 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD12-6 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Latch-up performance exceeds 100 mA per JESD78D Class II

  • Inputs accept voltages up to 5.5 V

  • Low noise overshoot and undershoot < 10% of VCCO

  • IOFF circuitry provides partial power-down mode operation

  • Multiple package options

  • Specified from ?40 °C to +125 °C

參數(shù)類(lèi)型

型號(hào) VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name Category
AXP1T34GM 0.9?-?5.5 0.9?-?5.5 CMOS ± 12 9 1 ultra low -40~125 XSON6 Uni-directional

封裝

型號(hào) 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
AXP1T34GM AXP1T34GMX
(935691627115)
Active r3 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115

環(huán)境信息

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
AXP1T34GM AXP1T34GMX AXP1T34GM rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

Series

文檔 (11)

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
AXP1T34 Dual supply translating buffer Data sheet 2023-12-01
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT886_115 XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-04-21
AXP1T34GM_Nexperia_Product_Reliability AXP1T34GM Nexperia Product Reliability Quality document 2024-06-16
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03

訂購(gòu)、定價(jià)與供貨

型號(hào) Orderable part number Ordering code (12NC) 狀態(tài) 包裝 Packing Quantity 在線購(gòu)買(mǎi)
AXP1T34GM AXP1T34GMX 935691627115 Active SOT886_115 5,000 訂單產(chǎn)品

樣品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可訂購(gòu)部件

型號(hào) 可訂購(gòu)的器件編號(hào) 訂購(gòu)代碼(12NC) 封裝 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi)
AXP1T34GM AXP1T34GMX 935691627115 SOT886 訂單產(chǎn)品