可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
---|---|---|---|---|
BCP51 | BCP51,115 | 933917270115 | SOT223 | 訂單產品 |
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Click here for more information45 V, 1 A PNP medium power transistors
PNP medium power transistors in a SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
High current
Three current gain selections
High power dissipation capability
AEC-Q101 qualified
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|
BCP51 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -45 | -1000 | 100 | 250 | 150 | N |
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
BCP51 | BCP51,115 (933917270115) |
Active | BCP51 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
BCP51_SER | 45 V, 1 A PNP medium power transistors | Data sheet | 2023-10-16 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
DERATSMD | Power Derating Curves for SMDs; General | Other type | 1999-05-06 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
SOT223_115 | SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2024-02-15 |
BCP51_Nexperia_Product_Reliability | BCP51 Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BCP51 | BCP51 SPICE model | SPICE model | 2024-08-27 |
BCP51 | Cad-Symbol of BCP51 | Software | 2008-11-20 |
BCP51_cauer | BCP51 RC thermal cauer model | Thermal design | 2020-06-22 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
BCP51 | BCP51 SPICE model | SPICE model | 2024-08-27 |
BCP51_cauer | BCP51 RC thermal cauer model | Thermal design | 2020-06-22 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
型號 | Orderable part number | Ordering code (12NC) | 狀態 | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
BCP51 | BCP51,115 | 933917270115 | Active | SOT223_115 | 1,000 | 訂單產品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.