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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

BSP130

N-channel vertical D-MOS logic level FET

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using vertical D-MOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.

此產品已停產

Features and benefits

  • Direct interface to Complementary (C-MOS) transitor and Transistor-Transistor Logic (TTL) devices

  • Very fast switching

  • No secondary breakdown

Applications

  • Line current interruptors in telephone sets

  • Relay, high-speed and line transformer drivers

參數類型

型號 Package version Package name Product status Channel type VDS [max] (V) Ptot [max] (W) Release date
BSP130 SOT223 SC-73 End of life N 300 1.5 2011-01-24

封裝

下表中的所有產品型號均已停產 。

型號 可訂購的器件編號，（訂購碼(12NC)） 狀態 標示 封裝 外形圖 回流焊/波峰焊 包裝
BSP130 BSP130,115
(934023500115)		 Obsolete BSP130 SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115
BSP130,135
(934023500135)		 Obsolete BSP130 SOT223_135

環境信息

下表中的所有產品型號均已停產 。

型號 可訂購的器件編號 化學成分 RoHS RHF指示符
BSP130 BSP130,115 BSP130 rohs rhf rhf
BSP130 BSP130,135 BSP130 rohs rhf rhf
品質及可靠性免責聲明

文檔 (18)

文件名稱 標題 類型 日期
BSP130 N-channel enhancement mode vertical D-MOS transistor Data sheet 2001-12-10
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP130 BSP130 SPICE model SPICE model 2012-06-08
BSP130_07_03_2012 BSP130.07_03_2012 Spice parameter SPICE model 2012-04-13
TN00008 Power MOSFET frequently asked questions and answers Technical note 2024-08-09
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。

模型

文件名稱 標題 類型 日期
BSP130 BSP130 SPICE model SPICE model 2012-06-08
BSP130_07_03_2012 BSP130.07_03_2012 Spice parameter SPICE model 2012-04-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.