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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

BSP89

N-channel vertical D-MOS logic level FET

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using vertical D-MOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.

不建議用在新設計中(NRND)。

Features and benefits

  • Direct interface to Complementary (C-MOS) transitor and Transistor-Transistor Logic (TTL) devices

  • Very fast switching

  • No secondary breakdown

Applications

  • High-speed line drivers

  • Line current interruptorss

  • Line transformer drivers

  • Relay drivers

參數類型

型號 Package version Package name Product status Channel type VDS [max] (V) Ptot [max] (W) Release date
BSP89
SOT223 SC-73 Not for design in N 240 1.5 2011-01-24

封裝

型號 可訂購的器件編號，（訂購碼(12NC)） 狀態 標示 封裝 外形圖 回流焊/波峰焊 包裝
BSP89
BSP89,115
(934018750115)		 Active BSP89 SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

環境信息

型號 可訂購的器件編號 化學成分 RoHS RHF指示符
BSP89
BSP89,115 BSP89 rohs rhf rhf
品質及可靠性免責聲明

文檔 (18)

文件名稱 標題 類型 日期
BSP89 N-channel enhancement mode vertical D-MOS transistor Data sheet 2020-01-03
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP89_15_02_2012 BSP89.15_02_2012 Spice parameter SPICE model 2012-04-13
TN00008 Power MOSFET frequently asked questions and answers Technical note 2024-08-09
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。

模型

文件名稱 標題 類型 日期
BSP89_15_02_2012 BSP89.15_02_2012 Spice parameter SPICE model 2012-04-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22

訂購、定價與供貨

型號 Orderable part number Ordering code (12NC) 狀態 包裝 Packing Quantity 在線購買
BSP89 BSP89,115 934018750115 Active SOT223_115 1,000 訂單產品

樣品

作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。

如果您沒有 Nexperia 的直接賬戶，我們的全球和地區分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可訂購部件

型號 可訂購的器件編號 訂購代碼(12NC) 封裝 從經銷商處購買
BSP89 BSP89,115 934018750115 SOT223 訂單產品