
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationIP4221CZ6-XS
ESD protection for high-speed interfaces
The device is designed to protect high-speed interfaces such as USB 2.0, Ethernet and Digital Visual Interface (DVI) against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal lines and is encapsulated in a leadless ultra small DFN1010-6 (SOT891) plastic package.
Special diode configuration protects all signal lines and offers ultra low line capacitance of only 1 pF. The rail-to-rail diodes are connected to the Zener diode which allows ESD protection to be independent of supply voltage.
Features and benefits
- System ESD protection for high-speed data lines such as USB 2.0, Ethernet and DVI
- All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±8 kV according to IEC 61000-4-2, level 4
- Line capacitance of only 1 pF for each channel
- Leadless ultra small DFN1010-6 package: 1 x 1 x 0.5 mm; pitch 0.5 mm
Applications
- High-speed receiver and transmitter port protection for:
- Mobile phones, smartphones and handsets
- TVs and monitors
- DVD recorders and players
- Notebooks, mother boards, graphic cards and ports
- Set-top boxes and game consoles
參數(shù)類型
型號 | Package name |
---|---|
IP4221CZ6-XS | XSON6 |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
IP4221CZ6-XS | IP4221CZ6-XS,132 (934061333132) |
Obsolete | 1X |
![]() XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
文檔 (10)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
IP4221CZ6-XS | ESD protection for high-speed interfaces | Data sheet | 2012-12-13 |
AN10910 | Protecting charger interfaces and typical battery charging topologies with external bypass transistors | Application note | 2021-04-12 |
Nexperia_document_brochure_ESD-Protection-Applications_022017 | ESD Protection Application guide | Brochure | 2018-12-21 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設(shè)計/技術(shù)支持,請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.