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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

PBSS8510PA

100 V, 5.2 A NPN low V_CEsat (BISS) transistor

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

PNP complement: PBSS9410PA.

Features and benefits

  • Low collector-emitter saturation voltage VCEsat

  • High collector current capability IC and ICM

  • Smaller required Printed-Circuit Board (PCB) area than for conventional transistors

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Leadless small SMD plastic package with medium power capability

Applications

  • Loadswitch

  • Battery-driven devices

  • Power management

  • Charging circuits

  • Power switches (e.g. motors, fans)

參數(shù)類(lèi)型

型號(hào) Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] TJ [max] (°C) fT [min] (MHz) Automotive qualified
PBSS8510PA SOT1061 DFN2020-3 2 x 2 x 0.65 NPN 500.0 100.0 5200.0 180.0 150 95.0 N

封裝

型號(hào) 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
PBSS8510PA PBSS8510PA,115
(934063924115)		 Active AE SOT1061
DFN2020-3
(SOT1061) 		SOT1061 REFLOW_BG-BD-1
SOT1061_115

環(huán)境信息

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
PBSS8510PA PBSS8510PA,115 PBSS8510PA rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (12)

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PBSS8510PA 100 V, 5.2 A NPN low V_CEsat (BISS) transistor Data sheet 2010-06-02
AN10909 Low VCEsat transistors in medium power loadswitch applications Application note 2013-03-14
AN11045 Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors Application note 2013-03-04
AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Application note 2021-06-23
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020-3_SOT1061_mk plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061 plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-05-27
SOT1061_115 DFN2020-3; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2020-04-21
PBSS8510PA_Nexperia_Product_Reliability PBSS8510PA Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PBSS8510PA PBSS8510PA SPICE model SPICE model 2024-08-27

支持

如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PBSS8510PA PBSS8510PA SPICE model SPICE model 2024-08-27
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02

訂購(gòu)、定價(jià)與供貨

型號(hào) Orderable part number Ordering code (12NC) 狀態(tài) 包裝 Packing Quantity 在線購(gòu)買(mǎi)
PBSS8510PA PBSS8510PA,115 934063924115 Active SOT1061_115 3,000 訂單產(chǎn)品

樣品

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如果您沒(méi)有 Nexperia 的直接賬戶(hù)，我們的全球和地區(qū)分銷(xiāo)商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷(xiāo)商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可訂購(gòu)部件

型號(hào) 可訂購(gòu)的器件編號(hào) 訂購(gòu)代碼(12NC) 封裝 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi)
PBSS8510PA PBSS8510PA,115 934063924115 SOT1061 訂單產(chǎn)品