可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
---|---|---|---|---|
PMEG3020EPAS | PMEG3020EPASX | 934068151115 | SOT1061D | 訂單產品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more information30 V, 2 A low VF Schottky barrier rectifier
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Average forward current IF(AV) ≤ 2 A
Reverse voltage VR ≤ 30 V
Low forward voltage VF ≤ 470 mV
Low reverse current
Reduced Printed-Circuit-Board (PCB) area requirements
Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
Leadless small SMD plastic package with visible and solderable side pads
Suitable for Automatic Optical Inspection (AOI) of solder joints
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Free-wheeling application
Reverse polarity protection
Low power consumption application
Battery chargers for mobile equipment
型號 | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [typ] @25 C (mV) | VF [max] (mV) | IR [typ] @25 C (μA) | IR [max] @25 C (μA) | Cd [max] (pF) | Remark | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG3020EPAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 30 | 2 | single | single | 410 | 470 | 435 | 2500 | 150 | solderable side pads | N |
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
PMEG3020EPAS | PMEG3020EPASX (934068151115) |
Active | CP |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
PMEG3020EPAS | 30 V, 2 A low VF MEGA Schottky barrier rectifier | Data sheet | 2017-05-04 |
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車 二極管和晶體管 | Brochure | 2022-04-26 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
SOT1061D_115 | DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-05-29 |
PMEG3020EPAS_Nexperia_Product_Reliability | PMEG3020EPAS Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PMEG3020EPAS | PMEG3020EPAS SPICE Model | SPICE model | 2015-04-23 |
TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
如果您需要設計/技術支持,請告知我們并填寫 應答表 我們會盡快回復您。
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
PMEG3020EPAS | PMEG3020EPAS SPICE Model | SPICE model | 2015-04-23 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
型號 | Orderable part number | Ordering code (12NC) | 狀態 | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
PMEG3020EPAS | PMEG3020EPASX | 934068151115 | Active | SOT1061D_115 | 3,000 | 訂單產品 |
作為 Nexperia 的客戶,您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶,我們的全球和地區分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.