外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|
| WLCSP10_4-2-4 | WLCSP10 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | 2010-02-11 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | PCMF2USB3X, PCMF2HDMI2X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 | Packing information | 2020-04-27 |
采用此封裝的產品
ESD protection, TVS, filtering and signal conditioning
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| PCMF2USB3BA | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |
|