可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
---|---|---|---|---|
PESD2USB3B | PESD2USB3B/CZ | 934660294087 | WLCSP10_4-2-4 | 訂單產品 |
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Click here for more informationESD protection for differential data lines
ElectroStatic Discharge (ESD) protection for one, two and three differential channels.
The devices are footprint compatible to PCMFxUSB3B/C common mode filters with ESD protection.
Diodes provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.
Type Number | Number of channels | Package name |
---|---|---|
PESD1USB3B/C | 1 | WLCSP5 |
PESD2USB3B/C | 2 | WLCSP10 |
PESD3USB3B/C | 3 | WLCSP15 |
Allows switching between PCMFxUSB3B/C common mode filters with ESD protection and PESDxUSB3B/C ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs)
ESD protection for one, two and three differential channels up to ±20 kV contact discharge according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
型號 | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
---|---|---|---|---|---|---|---|---|---|
PESD2USB3B | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Bidirectional | 4 | 4 | 0.29 | 9.5 | 20 |
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
PESD2USB3B | PESD2USB3B/CZ (934660294087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
PESDXUSB3B_C_SER | ESD protection for differential data lines | Data sheet | 2019-01-29 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | PCMF2USB3X, PCMF2HDMI2X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 | Packing information | 2020-04-27 |
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文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
型號 | Orderable part number | Ordering code (12NC) | 狀態 | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
PESD2USB3B | PESD2USB3B/CZ | 934660294087 | Active | WLCSP10_4-2-4_087 | 4,500 | 訂單產品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.