外形圖
封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
X2SON8 | plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body | 2016-04-21 |
相關(guān)文檔
文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
---|---|---|---|
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |