外形圖
封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
---|---|---|---|---|
SOT1269-2 | X2SON4 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | 2017-06-30 |
相關文檔
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
XSON4_SOT1269-2_mk | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Marcom graphics | 2019-02-04 |
SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
SOT1269-2_147 | X2SON4; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147 | Packing information | 2020-04-21 |
采用此封裝的產品
Analog & Logic ICs
型號 | 描述 | 快速訪問 |
---|---|---|
74AUP1G04GX4 | Low-power inverter |
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