外形圖
封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
SOT340-1 | SSOP24 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | MO-150 (JEDEC) | 2003-02-19 |
相關(guān)文檔
文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
---|---|---|---|
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT340-1 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT340-1_118 | SSOP24; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
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