外形圖
封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
---|---|---|---|---|
SOT763-1 | DHVQFN16 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
相關文檔
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT763-1_115 | DHVQFN16; Reel pack, SMD, 7" Q1/T1 product orientation | Packing information | 2020-04-21 |
采用此封裝的產品
Analog & Logic ICs
型號 | 描述 | 快速訪問 |
---|---|---|
NXB0106BQ | Dual supply translating transceiver; auto direction sensing; 3-state |
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