外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|
| SOT815-1 | DHVQFN24 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT815-1 | 3D model for products with SOT815-1 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN24_SOT815-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
| SOT815-1_118 | DHVQFN24; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SOT815-1_431 | DHVQFN24; Reel sulfur barrier pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,431 or Z Ordering code (12NC) ending 431 | Packing information | 2020-04-27 |
采用此封裝的產品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| 74AXP8T245BQ | 8-bit dual supply translating transceiver; 3-state |
|