外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|
| SOT364-1 | TSSOP56 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-19 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
| SOT364-1_118 | TSSOP56; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封裝的產品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| 74ALVCH16646DGG | 16-bit bus transceiver/register; 3-state |
|